About
Our Business
Business
01
PCB Business
Meiko provides state-of-the-art products, such as AnyLayer HDI ,which offer free connection among all layers, adapted to the shrinking size of mobile phones and other handheld devices, as well as high heat dissipation PCBs and high electric current PCBs capable of withstanding harsh environments like the inside of car engines and solar power generators.
Circuit Design
Meiko possesses state-of-the-art CAD systems capable of designing the optimal wiring for a limited space within a short period of time. Fully applying our production know-how straight from the design stage allows us to make the smooth transition to mass production.
Solder Stencils
Meiko provides high-reliability, high-precision, and high-quality solder stencils manufactured in state-of-the-art facilities at our production sites in Japan and other countries. From design to application, our metal masks have a proven record in a wide variety of fields, such as mobile devices, automobiles, and consumer devices. In addition, our integrated production and sales system has enabled us to achieve the shortest delivery times in the industry.
Assembly fixtures and equipment
As a PCB manufacturer, we leverage our unique strengths to provide assembly fixtures
and equipment, including PCB fixtures and resin processing. We use our years of experience and knowledge to propose optimal assembly products and services.
02
Electronics businesses
EMS(Electronic Manufacturing Services)
Meiko provides a total solution service to support our customers and help them flexibly adapt to changes in the market. This service integrates the outsourcing of all the processes involved in production, including pattern designing, manufacturing, component procurement, implementation, inspection, and shipment.
Industrial Equipment
We provide automation solutions, including soldering robots to automate and reduce labour in post-soldering PCB assembly processes, and material handling equipment for various manufacturing stages.
Imaging Equipment
Meiko’s imaging division developed and is manufacturing the world’s first multivision video magnifying device (processor) and peripherals, such as matrix switchers and converters. These products are widely used both in Japan and other countries.
03
R & D System
Embedded PCB
Meiko is developing built-in component technologies for fine pitch electrode bear chips and small passive components to further downsize and increase the sophistication of mobile devices. We are also actively conducting development activities for built-in component and simulation technologies that support large electric currents and high heat releasing, in response to increasing needs for automotive embedded power ICs in recent years.
Ultra-Thick Copper PWB
Meiko is developing ultra-thick copper PWBs capable of applying large electric currents by forming a multilayer structure PWB with thicker copper film on wiring layers. We are working on integrally fabricated PWBs by increasing the thickness of the wiring layer and using the same resin material to develop PWB forming technologies that enable both large electric currents to be passed and high reliability.
High Frequency Millimeter-wave PCB
Meiko is working to make PWBs thinner and smaller by integrating high-frequency circuits and control circuits. This is achieved by forming a hybrid structure of various high-frequency materials (PTFE, LCP, PPE, and Low-k Epoxy) and general materials (FR-4). We are also working on forming micro via-holes and multilayer of high-frequency materials to achieve higher density wiring. Besides, we carry out in-house evaluations of material properties and transmission properties of new high-frequency materials.
0.3 mm pitch CSP-mounted PCB
As smartphones and other mobile devices become more compact, lightweight, and multi-functional, the use of 0.35 and 0.3 mm pitch CSPs will become widespread. To keep up with this trend, we are developing an all-layer build-up structure adapted to 0.35 and 0.33 mm-pitch CSP wiring, reducing laser via diameter and via land diameter, and creating fine pitch circuit fabrication technologies.
Semi-additive HDI PCB
In the future, CSPs are expected to have increasingly narrower pitches and higher pin counts, meaning wiring capacitance must be improved by increasing the number of wire between CSP electrodes from current one to at least two. To achieve this, fine wiring forming technologies that feature L/S=40/40 μm or less are needed. In the light of these trends, we are developing semi-additive technologies using copper foil to replace the etching technologies currently used.