The technology of high alignment accuracy as well as applying multi-stacked HDI technology, the high density multi-layer structure is tailored for customers requirements.
Carries various types of copper PCBs (with up to 200 μm copper thickness) used for large electric current units that can support regular electric current over 50A.
Copper inlay PCB can release heat from heater elements mounted on an electronic circuit board through copper inlays to a bottom side heat sink.
HDI PCB is composed of Staggered Via and Stacked Vias. Laser Via hole, IVH and Plated Through Hole are used in combination.
Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.