HDI PCB is composed of Staggered Via and Stacked Vias. Laser Via hole, IVH and Plated Through Hole are used in combination.
Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.
Meiko has been developing a connection process using laser via and plating in addition to a bonding process using solder materials.
FR4-FLEX/M-VIA Flex® is rigid-flex PCB without polyimide that can be utilized for applications that do not require repeated bending and as an alternative to connectors.
FPC (flexible printed circuits) is also known as a flexible PCB. It is excellent thinness, lightness, softness and durability using insulating film as a material.