HDI PCB (M-VIA Ⅰ/Ⅱ)
AnyLayer PCB (M-VIA Ⅲ)
High Layer Count PCB
Heavy Copper PCB
Metal Base Heat Dissipation PCB
Embedded Devices PCB
High Frequency Millimeter-wave PCB
Copper Inlay PCB
Message from the President
R & D
To individual Investors
Quality Policy/Environmental Policy
Meiko's Approach to CSR
Meiko’s Statement on Health Initiative
The latest notice concerning the performance is posted.
Information regarding performance highlights, key financial indicators, and order statistics by quarter.
Gathered information to help you understand more about Meiko.
Various IR documents, such as Financial Statements and Annual Reports, etc..
Past accomplishments and planned IR activities.
Basic information regarding stocks and shareholders' meetings.
Frequently asked questions about our business performance and stocks.
Basic policies and standards concerning information disclosure are posted.
Notice points when using this site are listed.