HDI PCB (M-VIA Ⅰ/Ⅱ)
These are multi-layer PCBs in which layers are piled up one by one using laser technology and plating technology after forming a conductor pattern on an insulating layer. Because wiring is possible on the connection part of each layer, this method achieves higher density and higher integration than ordinary multi-layer through-hole PCBs. They are used for devices that require high-density wiring in a limited space.
- HDI PCBs with Staggered Via and Stacked Via
- Any combination with Laser Via, IVH or Plated Through Hole is possible
- Cellular phones
- Small mobile devices
- Car navigation systems
- Digital cameras
- Digital video cameras
- Multi-function printers, etc.
|Parameter||Symbol||Standard Spec||Min Spec|
|Line width/Spacing||HDI Layer||A / A'||75 / 75||50 / 50|
|Core Layer||B / B'||75 / 75||50 / 50|
|Plated Through Hole||Drill Diameter||C||300||250|
|Pad Diameter||Outer Layer||D||550||450|
|Pad Diameter||Outer Layer||G||500||400|
|Laser Via||Via Diameter||I||100||75|
|Dielectric Thickness||HDI Layer||K||60||40|
- These figures are merely settings. They are subject to change without notice.
AnyLayer PCB (M-VIA Ⅲ)
AnyLayer PCB with Laser Via and Filled Plating on each layer, it is possible to build thin construction and 0.4mm pitch CSP by AnyLayer interconnection.
Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.