AnyLayer PCB (M-VIA Ⅲ)
These are PCBs that enable free connection between all layers combining laser technology and filled plating technology that allows ultra-fine processing. With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high performance devices.
- AnyLayer PCBs with Laser Via and Filled Plating on each layer
- Thinner 0.4mm pitch CSP by AnyLayer interconnection supported
- Mass-production of 10-layer M-VIA Ⅲ (AnyLayer PCBs) for mobile devices
- Wearable devices
- Digital cameras
- Digital video cameras
- Small mobile devices, etc.
|Parameter||Symbol||Standard Spec||Min Spec|
|Line width/Spacing||HDI Layer||A / A'||75 / 75||50 / 50|
|Plated Through Hole||Drill Diameter||B||300||250|
|Pad Diameter||Outer Layer||C||550||450|
|Laser Via||Via Diameter||E||100||75|
|Dielectric thickness||HDI Layer||G||60||40|
- These figures are merely settings. They are subject to change without notice.