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Embedded Devices PCB

Small mobile devices feature an increasing number of passive components that require a higher-density installation. Unfortunately the surface mounting area of conventional surface-mount technology (two-dimensional implementation) is unable to support these components. That is why the three-dimensional implementation using embedded PCB technology was proposed.
Meiko independently developed a connection process using laser via and plating in addition to a bonding process using solder materials, and has a track record of mass production with both processes.

Embedded Devices PCBs


  • Reduction of the surface mount area by embedding chip components (resistance/condenser)
  • Improvement of electrical properties by shorter wiring distance between surface-installed ICs and embedded components
  • Shorter pitches between components and better heat resistance
    enabled by connection between component terminals using laser via and copper plating


  • Memory substrate
  • Various modules

Cross section

Plating connection
Plating connection
soldered joint (6-layer mass produced products)
soldered joint (6-layer mass produced products)

Development roadmap

Development roadmap

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