HDI PCB (M-VIA Ⅰ/Ⅱ)
AnyLayer PCB (M-VIA Ⅲ)
High Layer Count PCB
Heavy Copper PCB
Metal Base Heat Dissipation PCB
Embedded Devices PCB
High Frequency Millimeter-wave PCB
Copper Inlay PCB
Message from the President
R & D
To individual Investors
Meiko's Approach to CSR
Note at the time of the inquiry
The reply to inquiries, please understand that it may not be a clear answer or your time by its content and timing. In addition, the reply mail, or reprint a portion or all of our without permission e-mail, please refrain from taking advantage of the secondary.
HDI PCB is composed of Staggered Via and Stacked Vias. Laser Via hole, IVH and Plated Through Hole are used in combination.
Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.
Search by application