Measurement substrate manufacturing/characteristic evaluation
We provide substrate manufacturing, analysis, reliability testing, and characteristic evaluation.
We support our customers in principle verification and advanced development.
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Development and manufacturing of various mechatronics products
Measurement substrate manufacturing/characteristic evaluation
01
Measurement board manufacturing
We manufacture measurement substrates for our customers' research and development.
02
Substrate analysis
Perform analysis of the measurement substrate.
03
Reliability Testing
We perform reliability tests on the measurement board.
04
Examples of board miniaturization
We designed and manufactured one component-embedded board from the circuit diagrams of two surface mount boards, achieving miniaturization of the board.
Source: Proceedings of the 38th Japan Institute of Electronics Packaging Spring Conference, 15B4-3, March 2024
Source: Proceedings of the 38th Japan Institute of Electronics Packaging Spring Conference, 15B4-3, March 2024
05
Example of high frequency characteristic evaluation
We measured the minute differences in transmission loss due to differences in the metal layer of electroless gold plating.
Source: Proceedings of the 39th Japan Institute of Electronics Packaging Spring Conference, 11A1-3, March 2025
Source: Proceedings of the 39th Japan Institute of Electronics Packaging Spring Conference, 11A1-3, March 2025
06
Example of heat dissipation characteristic evaluation
We measured the difference in the temperature generated by semiconductor chips due to differences in board resin materials.
Source: Proceedings of the 39th Japan Institute of Electronics Packaging Spring Conference, 13B4-2, March 2025
Source: Proceedings of the 39th Japan Institute of Electronics Packaging Spring Conference, 13B4-2, March 2025
07
Example of power supply impedance evaluation
We measured the difference in power supply impedance due to differences in bypass capacitor placement.
Source: Proceedings of the 38th Japan Institute of Electronics Packaging Spring Conference, 15B4-3, March 2024
Source: Proceedings of the 38th Japan Institute of Electronics Packaging Spring Conference, 15B4-3, March 2024
Contact About the productInquiry
In addition to major corporate clients, we also serve universities, research institutes,
We also accept consultations from venture companies.
We also accept one-off orders from design companies and parts trading companies,
Please feel free to contact us for technical advice.
