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Any-layer PWB in which each layer is formed by CO2 laser and filled plating. The highly flexible design and improved density make it possible to create smaller and thinner smartphones and other high-performance mobile devices.
Used for products that require greater current capacity than conventional applications, including solar cells and low emission vehicles such as hybrid cars and electric vehicles. Our original technology achieves a copper thickness of over 400μm.
PWBs that employ a combination of low cost aluminum and high-quality heat dissipating resin, thereby exhibiting superb heat dissipation characteristics. Used for LED lighting fixtures, which are considered to be the next-generation light source.
Chip condensers and chip resistors are embedded in this PWB to provide added density while boosting performance. Because more space is available for installing other components, the use of this PWB enables smaller devices to be created. It also helps improve electrical characteristics, requiring only minimum wiring between the surface-mounted ICs and embedded passive components.
HDI PWBs with staggered via and stacked via.
Any-layer PWBs created through the combined use of laser/plating technology and B2it.
PWBs that feature a combination of flexible and rigid types.
Used for a wide variety of applications, from specialized products with high thermal or physical characteristics to general-purpose products.
Fine pitch contacts with high durability, enabled by simultaneous formation of bumps and conductors through our patented transfer circuitization process.
