HDI PCB (M-VIA Ⅰ/Ⅱ)
AnyLayer PCB (M-VIA Ⅲ)
High Layer Count PCB
Heavy Copper PCB
Metal Base Heat Dissipation PCB
Embedded Devices PCB
High Frequency Millimeter-wave PCB
Copper Inlay PCB
Message from the President
R & D
To individual Investors
Meiko's Approach to CSR
Note at the time of the inquiry
The reply to inquiries, please understand that it may not be a clear answer or your time by its content and timing. In addition, the reply mail, or reprint a portion or all of our without permission e-mail, please refrain from taking advantage of the secondary.
We have no recruitment for new graduates at present.
We have no recruitment for mid-career at present.