FR4-FLEX/M-VIA Flex® is rigid-flex PCB without polyimide and can be utilized for applications that do not require repeated bending. Meiko has two types of Rigid-Flex PCB without polyimide, and FR4-FLEX achieved low-cost and high-reliability PCBs by using ordinary FR-4 only as the primary material. On the other hand, M-VIA Flex® improves flexibility by combining RCC and FR-4 as primary materials.
FR4-FLEX/M-VIA Flex® can be used as an alternative to connectors to reduce process load and cost by reducing connectors.
- Reduction in process load and cost by reducing connectors
- Offer of the three-dimensional structure and larger capacity of multiple memories
- Zo design of flexible sections and improved transmission quality
- Automotive devices
- Consumer devices
- Mobile terminals
|Line width/spacing||A / B||≧0.15mm / ≧0.15mm|
|Conductor thickness outer/inner layer||C / D||0.051mm / 0.035mm|
|Minimum radius of flex||F||≧3.8mm|
|Thickness of flex||G||0.20 - 0.24mm|
|Width of flex||H||<160 mm|
|Length of flex||Ｉ||6.0mm
|Conductor length in rigid part||J||≧1mm|
|Spacing between conductor and flex||K||≧1mm|
|Spacing between SR-opening and flex||L||≧0.5mm|
|Spacing between TH and flex||M||≧2mm|
|Spacing between flex SR and flex||N||≧0.5mm|
|Overlapping of flex SR||O||≧0.5mm|
- These figures are merely settings. They are subject to change without notice.
These PCBs integrate flexible PCBs and rigid PCBs. Because connectors are not required for connection between layers, they are ideal for digital devices that are vulnerable to noise effect.
FPC (flexible printed circuits) is also known as a flexible PCB. It is excellent thinness, lightness, softness and durability using insulating film as a material.