Development and manufacturing of mechatronics products | Printed circuit board design and manufacturing by Meiko Co., Ltd.

Five strengths of Meiko's FA business

01.

Over 40 years of equipment development experience

02.

Extensive knowledge and experience of electronic circuit board manufacturing equipment

03.

Sier proposes automated and labor-saving equipment that meets customer needs

04.

We provide comprehensive support from design and development to after-sales service

05.

Development and manufacturing departments in three locations: Japan, Vietnam, and China

We undertake the design, development, and manufacturing of automated equipment. Please see examples of products we have actually developed.

Substrate process

Copper inlay board manufacturing equipment

Overview: Measures the board thickness and adjusts the copper pins according to the board thickness.
Automated high heat dissipation circuit board manufacturing equipment that inserts and presses
Process: L-shaped cart loader → Plate thickness measurement
→Copper inlay press →L-sized cart unloader
Features: Uses one 6-axis robot and two SCARA robots
Three camera alignment systems used
PCB size: 334x460 ~ 535x615mm
Paper folding: Yes
Device dimensions: W5200 x D3300 x H2030mm

Substrate process Copper inlay substrate manufacturing equipment image 1

Substrate process Copper inlay substrate manufacturing equipment image 2

Board laser marker

Overview: Automatic machine that performs laser marking on both sides of a circuit board
Features: AGV rack delivery specifications
Two 6-axis robots in use
Equipped with an XY table, it can print on the entire surface of the board.
PCB size: 338x510 ~ 618x714mm
Paper folding: Yes
Device dimensions: W2400 x D3900 x H2350mm
* Sheet type also has a proven track record

Coater related

Roll-to-roll coating equipment

Overview: Film is sent roll to roll to the slit die coater
This automated device performs everything from applying high viscosity slurry to drying and winding.
Process: Coating → Inspection after coating → Drying → Film thickness inspection → Winding
Features: Clean specifications, post-application inspection, film thickness inspection
Coating width: 534mm
Device dimensions: L18600 x W5300 x H2440mm

Coater related Roll-to-roll coating device image 1

Coater related: Roll-to-roll coating device image 2

Resist coating process automation equipment

Overview: Automates the entire process from resist application to drying.
Coating is done with a spin coater
Process: Loader cassette → Resist coating → Reduced pressure drying → Edge cleaning
→Hot plate →Number printing →Unloader cassette
Features: Clean room specifications, 1 double-arm robot, 1 XYZ robot
Work size: 100x100mm
Work storage capacity: 14 pieces
Device size: W2200 x D1600 x H2200mm

Coater-related: Resist coating process automation equipment image 2

Sheet-fed coater line

Overview: A line that applies special high-viscosity materials
Process: Loader → Slit die nozzle application → Drying
→ Dispenser application → Drying → Unloader
Features: Clean specifications, secondary battery compatible specifications
Application width: 100mm
Device size: L4150 x W1250 x H2400mm

Coater related: Sheet-fed coater line image 2

Material handling related

Stage reservation material handling

Overview: Automating the process of placing substrates on the process equipment stage
Two types of hands can be used to change the grip and print on both sides
Process: L-shaped dolly loader → inkjet printer
→L-sized trolley unloader
Features: Uses one 6-axis robot and one XYZ robot
Automatic variable hand with outer circumference holding clamp
PCB size: 338x404 ~ 535x610mm
Paper folding: Yes
External dimensions: W2000 x D3100 x H2400mm (excluding process machine)

Laser processing machine input machine receiving machine

Overview: Automating the process of inserting and receiving substrates into a laser processing machine
Features: Insertion and removal of slip sheets, PCB inversion, AGV linked type, various types with proven track record
PCB size: 338x510 ~ 618x714mm
Equipment dimensions: W4570 x D2730 x H1600mm (depending on process and type)

Material handling related Laser processing machine input machine receiving machine image 2

PCB input/receiving machine

Overview: Installed before and after each line in the circuit board manufacturing process to input and receive circuit boards
Automation
Features: AGV rack delivery specifications, W rack type
PCB size: 338x510 ~ 618x714mm
Paper folding: Yes
External dimensions: W2860 x D2340 x H2300mm (depending on process and whether or not interleaf paper is used)

Material handling related PCB input/receive machine image 1

Material handling related PCB input and output machine image 2

AGV

Overview: Used for transport between processes on a circuit board production line
Features: 2D code travel, with lift mechanism for board rack delivery
Portable weight: 300kg
Maximum speed: 1.0m/s Paper closing: Yes
External dimensions: W632 x L861 x H405mm (H315mm without lift)
*1000kg specification also available