We are developing a "Liquid Loop" substrate with a built-in water-cooling structure as a substrate technology that further improves the heat dissipation of metal-based substrates. By incorporating a water flow channel into the metal-based substrate, it is possible to significantly reduce the thickness and weight, as well as to achieve high efficiency that maximizes the performance of power semiconductors.
Furthermore, the ability to form wiring patterns on both the front and back surfaces enables the design of small, compact, and highly efficient power devices.