Embedded Device PCBs

A board for flexible wiring and ultra-compactness. As the number of passive components mounted on small mobile devices increases, there is a demand for higher density component mounting. However, as there is a limit to the surface mounting area that can be achieved with conventional surface mounting technology (two-dimensional mounting arrangement), three-dimensional mounting arrangement using "component-embedded boards" has been proposed. Meiko has been researching and developing "component-embedded boards" for many years and has an excellent track record.

High-density substrate
Embedded Device PCBs
01

Features of Embedded Device PCBss

  • Miniaturization and high integration of products that mount chip components inside a substrate
  • Reduced wiring length reduces inductance and noise
02

Main uses

  • Communication Module

    Communication Module

  • Wearable devices

    Wearable devices

  • Camera module

    Camera module

Contact About the productInquiry

In addition to major corporate clients, we also serve universities, research institutes,
We also accept consultations from venture companies.
We also accept one-off orders from design companies and parts trading companies,
Please feel free to contact us for technical advice.