Products to keep up with new needs and new developments in the world
Meiko provides various state-of-the-art products, such as high-density and high-performance PCBs for smartphones; PCBs compatible with high frequency to achieve automatic driving; and high-heat-dissipation and large-electric-current PCBs capable of withstanding a challenging environment in an automobile engine room or solar power generation equipment.
High-density wiring
Meiko provides high-density-wiring PCBs with the higher degree of design freedom by using the technologies of ultra-fine processing CO2 lasers and filled plating and the technologies of high alignment accuracy. They contribute significantly to the downsizing and thinning of smartphones and other high-performance mobile devices.
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HDI PCB (M-VIA Ⅰ/Ⅱ)
HDI PCB is composed of Staggered Via and Stacked Vias. Laser Via hole, IVH and Plated Through Hole are used in combination.
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AnyLayer PCB (M-VIA Ⅲ)
AnyLayer PCB with Laser Via and Filled Plating on each layer, it is possible to build thin construction and 0.4mm pitch CSP by AnyLayer interconnection.
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High Layer Count PCB
The technology of high alignment accuracy as well as applying multi-stacked HDI technology, the high density multi-layer structure is tailored for customers requirements.
High frequency support
Meiko provides PCBs made from high-frequency materials (LCP, PPE, Low-k Epoxy) for products using ADAS (Advanced Driver Assistance System) and other high-frequency radars.
High reliability
Meiko has a long-standing track record of delivery in automotive electronics and other areas that require high reliability. Our products enable the balance between low cost and high quality by selecting optimal materials depending on the required electric, thermal and physical characteristics.
Large electric current support
Meiko provides PCBs used for solar power generation, high-power motors for eco-cars and other products in which large electric current flows. They have a much thicker copper pattern for the circuit than conventional PCBs.
High heat dissipation support
Meiko provides PCBs that realized high heat dissipation by combining aluminum and copper ingots for LED lights, power device driving circuits and other products that require heat dissipation.
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Metal Base Heat Dissipation PCB
Offers aluminum and copper based heat dissipation PCB that combines with high quality heat dissipation resin.
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Copper Inlay PCB
Copper inlay PCB can release heat from heater elements mounted on an electronic circuit board through copper inlays to a bottom side heat sink.
Space saving support
As small mobile devices adopt higher-density packaging, the demand for space saving is increasing. Meiko provides PCBs that can be used as an alternative to a connector and ones in which components are mounted, enabling free product design.
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FR4-FLEX/M-VIA Flex®
FR4-FLEX/M-VIA Flex® is rigid-flex PCB without polyimide that can be utilized for applications that do not require repeated bending and as an alternative to connectors.
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Embedded Devices PCB
Meiko has been developing a connection process using laser via and plating in addition to a bonding process using solder materials.
Flexible (flexibility support)
Meiko provides flexible PCBs for small mobile devices and digital still cameras that incorporate many high-performance components. They help enhance the degree of total design freedom by enabling the creation of thin products with the connector-less design or through achieving three-dimensional implementation.
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FPC
FPC (flexible printed circuits) is also known as a flexible PCB. It is excellent thinness, lightness, softness and durability using insulating film as a material.
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Rigid-Flex PCB
These PCBs integrate flexible PCBs and rigid PCBs. Because connectors are not required for connection between layers, they are ideal for digital devices that are vulnerable to noise effect.
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FR4-FLEX/M-VIA Flex®
FR4-FLEX/M-VIA Flex® is rigid-flex PCB without polyimide that can be utilized for applications that do not require repeated bending and as an alternative to connectors.
Electronics Assembly and Interconnect Engineering Center
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