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Features

• Fine pitch contacts with high durability, enabled by simultaneous formation of bumps and conductors through our patented transfer circuitization process.

Applications

• Probe for full contact FPD tester.
• Probe for 100% coverage FPD tester.
• Probe for LSI tester.

Specification

unit:μm

Item	HBC Rigid type	TFPC Flexible type
Base material	Glass/Epoxy	Polyimide
Pitch	>20	>20
Conductor width	>10	>10
Contacts	Bump	Bump
Contact performance	△ Fair	◎ Excellent
Durability	◎ Excellent	○ Good
Precision	◎ Excellent	○ Good

• High-density HDI PWBs
  • M-VIA I / II
  • M-VIA III
  • M-VIA B
  • Rigid-Flex PWB
• New Products
  • High Electric Current PWB
  • Aluminum Base Heat Dissipation PWB
  • Embedded Passive Devices PWB
  • Speciality PWB Test Probe Board with bump Contacts
• Current Products
  • Double-sided / Multi-Layer PWB