Features

• High Density Rigid-Flex PWB that integrates Flexible PWB with M-VIA HDI Technology.
• Rigid-Flex PWB can make Products Design more flexible.
• 4Layer Rigid-Flex PWB Thickness : Min 0.25mm(Volume Production), 0.20mm(Prototype).

Applications

• Cellular Phone, DSC, Camcorder, Camera Module.

Stackup

• 
  1+2+1 Structure
• 
  2+4+2 Structure

DesignRule

unit:μm

Parameter			Simbol	2011年	2012年
Line width / Spacing	HDI Layer		A/A`	75/75	75/75
	Rigid Layer		B/B`	75/75	75/75
	FPC Layer		C/C`	50/75	50/50
Plated Through Hole	Drill Diameter		D	250	200
	Pad Diameter	Outer Layer	E	500	450
		Inner Layer	F	550	500
IVH	Drill Diameter		G	250	200
	Pad Diameter	Outer Layer	H	500	450
		Inner Layer	I	550	500
Laser Via	Via Diameter		J	100	100
	Pad Diameter		K	250	250
PWB Thickness	4Layer （1+2+1）		L	250	200
	6Layer （2+2+2）			450	400

* These figures are merely settings. They are subject to change without notice.

Cross Section

• 
  6Layer Rigid-Flex PWB
• 
  4Layer Rigid-Flex PWB